BELGIUM • Smart packaging is already beginning to drive consumer demand and influence purchasing decisions while transforming the retail experience and stock management processes. Labelexpo Europe 2015 is to play host to the Smart Packaging Lab feature area where attendees to the show will be able to discover the label and packaging technology of tomorrow.
It will include a roundup of the latest advances in substrates, inks, digital systems and printing relevant to this area. Particularly it will include include augmented reality systems, radio frequency identification (RFID) and near-field communication (NFC) smart tags alongside anti-bacterial films that prevent label contamination. Smart Packaging Lab is one of a number of ffeatures spread across the show floor, including the Packprint Workshop and The Linerless Trail.
Avery Dennison will feature RFID technology from its Retail Branding and Information Solutions (RBIS) business, and will feature FiberTracker, an anti-counterfeiting labeling system which features a paper facestock with unique fiber patterns that can be scanned at point of purchase to validate product authenticity. The company will also demonstrate the capabilities of DirectLink, which uses NFC technology to deliver special offers, videos, and product information, and a printed electronic label that highlights time, temperature and tracking information to ensure compliance of product handling.
Taghleef Industries will be promoting Derprosa Bacterstop’s range of anti-bacterial BOPP films for food contamination prevention applications. The BOPP films are treated on one side with either matte or gloss with anti-bacterial properties, while the other side is corona treated for printing and laminating. Applications include pressure-sensitive, roll-fed wrap around and in-mold labels.
And Systec, a German manufacturer of cylinder and flatbed screen printing and slitting equipment, will be displaying various techniques for printing flexible printed circuits for labels and electronic devices. These techniques will include via hole printing and contact drying for effectively printing and drying a variety of conductive inks.